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SF1206SP0802|BOURNS|simage
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SF-1206SP080-2

Fuse Chip Slow Blow Acting 0.8A 63V SMD Solder Pad 1206 Ceramic T/R

Bourns
数据表 

产品技术规范
  • 欧盟RoHS指令
    Compliant
  • 美国出口管制分类ECCN编码
    EAR99
  • 环保无铅
    Active
  • 美国海关商品代码
    8536.10.00.40
  • Automotive
    No
  • PPAP
    No
  • Type
    Chip
  • Acting
    Slow Blow
  • Application
    Battery Charger|Cell Phone|DVD|Digital Camera|Disk Drive|Industrial Controller
  • Fuse Size (mm)
    3.1 X 1.55 X 0.6
  • Current Rating (A)
    0.8
  • Maximum Voltage Rating (V)
    63
  • Maximum DC Voltage Rating (V)
    63
  • Breaking Capacity @ Rated Voltage (A)
    50@63VDC
  • Typical Melting I2t (A²S)
    0.072
  • Typical Cold Resistance (Ohm)
    0.215
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -20
  • Maximum Operating Temperature (°C)
    105
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    1.55
  • Product Length (mm)
    3.1
  • Product Height (mm)
    0.6
  • Fuse Material
    Ceramic
  • Mounting
    Surface Mount
  • Package/Case
    1206

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