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S25FL128SAGMFIR01|INFINEON|simage
S25FL128SAGMFIR01|INFINEON|limage
Flash

S25FL128SAGMFIR01

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 128M-bit 128M/64M/32M x 1/2-bit/4-bit 14.5ns 16-Pin SOIC W Tube

Infineon Technologies AG
数据表 

产品技术规范
  • 欧盟RoHS指令
    Compliant
  • 美国出口管制分类ECCN编码
    3A991b.1.a.
  • 环保无铅
    Active
  • 美国海关商品代码
    8542.32.00.71
  • Automotive
    No
  • PPAP
    No
  • Cell Type
    NOR
  • Chip Density (bit)
    128M
  • Architecture
    Sectored
  • Boot Block
    Yes
  • Block Organization
    Symmetrical
  • Location of Boot Block
    Bottom|Top
  • Address Width (bit)
    32
  • Sector Size
    64Kbyte x 256
  • Page Size
    256byte|512byte
  • Number of Bits/Word (bit)
    1/2/4
  • Number of Words
    128M/64M/32M
  • Programmability
    Yes
  • Timing Type
    Synchronous
  • Max. Access Time (ns)
    14.5
  • Maximum Erase Time (s)
    165/Bulk
  • Maximum Programming Time (ms)
    0.75/Page
  • Process Technology
    65nm
  • Interface Type
    Serial (SPI, Dual SPI, Quad SPI)
  • Minimum Operating Supply Voltage (V)
    2.7
  • Maximum Operating Frequency (MHz)
    133
  • Typical Operating Supply Voltage (V)
    3|3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Programming Voltage (V)
    2.7 to 3.6
  • Operating Current (mA)
    100
  • Program Current (mA)
    100
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    Yes
  • ECC Support
    Yes
  • Support of Page Mode
    No
  • Minimum Endurance (Cycles)
    100000
  • Packaging
    Tube
  • Mounting
    Surface Mount
  • Package Height
    2.3
  • Package Width
    7.5
  • Package Length
    10.3
  • PCB changed
    16
  • Standard Package Name
    SO
  • Supplier Package
    SOIC W
  • Pin Count
    16
  • Lead Shape
    Gull-wing

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