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MX29LV640ETXEI70GTRAY|MACRONIX|limage
MX29LV640ETXEI70GTRAY|MACRONIX|simage
Flash

MX29LV640ETXEI-70G/TRAY

NOR Flash Parallel 3V/3.3V 64M-bit 8M x 8/4M x 16 70ns 48-Pin TFBGA

Macronix International Co., Ltd.
数据表 

产品技术规范
  • 欧盟RoHS指令
    Compliant
  • 美国出口管制分类ECCN编码
    3A991b.1.a.
  • 环保无铅
    Active
  • Automotive
    No
  • PPAP
    No
  • Cell Type
    NOR
  • Chip Density (bit)
    64M
  • Architecture
    Sectored
  • Boot Block
    Yes
  • Block Organization
    Asymmetrical
  • Location of Boot Block
    Top
  • Address Width (bit)
    23/22
  • Sector Size
    8Kbyte x 8|128Kbyte x 127
  • Number of Banks
    4
  • Number of Bits/Word (bit)
    8/16
  • Number of Words
    8M/4M
  • Programmability
    Yes
  • Timing Type
    Asynchronous
  • Max. Access Time (ns)
    70
  • Maximum Erase Time (s)
    0.7(Typ)/Sector
  • Maximum Programming Time (ms)
    11000(Typ)/Word
  • OE Access Time (ns)
    30
  • Process Technology
    110nm
  • Interface Type
    Parallel
  • Minimum Operating Supply Voltage (V)
    2.7
  • Typical Operating Supply Voltage (V)
    3|3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Programming Voltage (V)
    2.7 to 3.6
  • Operating Current (mA)
    70
  • Program Current (mA)
    30
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    Yes
  • ECC Support
    No
  • Support of Page Mode
    No
  • Minimum Endurance (Cycles)
    100000(Typ)
  • Mounting
    Surface Mount
  • Package Height
    0.65(Min) mm
  • Package Width
    6 mm
  • Package Length
    8 mm
  • PCB changed
    48
  • Standard Package Name
    BGA
  • Supplier Package
    TFBGA
  • Pin Count
    48
  • Lead Shape
    Ball

文档和资源

数据表
设计资源