DRAM 芯片

MT53E128M32D2DS-046 AAT:A

DRAM Chip Mobile LPDDR4 SDRAM 4Gbit 128Mx32 200-Pin WFBGA Dry/T/R Automotive AEC-Q100

Micron Technology

产品技术规范

• RoHS (Unione Europea)

  Compliant

• ECCN (Stati Uniti)

  EAR99

• Stato del componente

  Obsolete

• Codice HTS

  8542.32.00.28

• Automotive

  Yes

• PPAP

  Unknown

• DRAM Type

  Mobile LPDDR4 SDRAM

• Chip Density (bit)

  4G

• Organization

  128Mx32

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  4166

• Maximum Operating Temperature (°C)

  105

• Number of I/O Lines (bit)

  32

• Packaging

  Dry|Tape and Reel

• Mounting

  Surface Mount

• Package Height

  0.8

• Package Width

  10

• Package Length

  14.5

• PCB changed

  200

• Standard Package Name

  BGA

• Supplier Package

  WFBGA

• Pin Count

  200

• Lead Shape

  Ball