DRAM 芯片

MT49H16M36SJ-18 IT:B

DRAM Chip DDR RLDRAM2 576Mbit 16Mx36 1.8V 144-Pin FBGA Tray

Micron Technology

产品技术规范

• 欧盟RoHS指令

  Compliant

• 美国出口管制分类ECCN编码

  EAR99

• 环保无铅

  LTB

• 美国海关商品代码

  8542.32.00.02

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR RLDRAM2

• Chip Density (bit)

  576M

• Organization

  16Mx36

• Number of Internal Banks

  8

• Number of Words per Bank

  2M

• Number of Bits/Word (bit)

  36

• Data Bus Width (bit)

  36

• Maximum Clock Rate (MHz)

  533

• Maximum Access Time (ns)

  0.12

• Address Bus Width (bit)

  25

• Interface Type

  HSTL

• Minimum Operating Supply Voltage (V)

  1.7

• Maximum Operating Supply Voltage (V)

  1.9

• Operating Current (mA)

  1185

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  36

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.3(Min)

• Package Width

  11

• Package Length

  18.5

• PCB changed

  144

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  144

• Lead Shape

  Ball