应用处理器和 SOC

MIMX8ML4CVNKZAB

SOC i.MX 8M ARM Cortex A53/ARM Cortex M7 548-Pin LFBGA Tray

NXP Semiconductors

产品技术规范

• EU RoHS

  Compliant

• ECCN (US)

  5A992c.

• Part Status

  Active

• HTS

  8542.31.00.70

• Automotive

  No

• PPAP

  No

• Family Name

  i.MX 8M

• Device Core

  ARM Cortex A53|ARM Cortex M7

• Maximum Clock Rate (MHz)

  1600/800

• Program Memory Type

  ROM

• Data Bus Width (bit)

  64

• Program Memory Size

  256KB

• RAM Size

  868KB

• Type

  Applications Processor

• Processing Unit

  Microcontroller

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Interface Type

  CAN/Ethernet/I2C/I2S/SPI/UART/USB

• SPI

  3

• I2C

  6

• I2S

  0

• UART

  4

• Data Cache Size

  32KB

• USB

  2

• Instruction Cache Size

  32KB

• USART

  0

• CAN

  2

• PCI

  0

• Ethernet

  2

• Programmability

  Yes

• Core Architecture

  ARM

• Maximum Expanded Memory Size

  8GB

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.17(Max)

• Package Width

  15

• Package Length

  15

• PCB changed

  548

• Standard Package Name

  BGA

• Supplier Package

  LFBGA

• Pin Count

  548