DRAM 칩

IS46LQ32256A-062BLA2

DRAM Chip Mobile LPDDR4 SDRAM 8Gbit 256Mx32 1.1V/1.8V Automotive 200-Pin TFBGA

Integrated Silicon Solution Inc

产品技术规范

• 유럽 연합 RoHS 명령어

  Compliant

• 미국수출통제분류ECCN 인코딩

  EAR99

• 친환경 무연

  Active

• 미국 세관 상품 코드

  8542.32.00.36

• Automotive

  Yes

• PPAP

  Yes

• DRAM Type

  Mobile LPDDR4 SDRAM

• Chip Density (bit)

  8G

• Organization

  256Mx32

• Number of Internal Banks

  16

• Number of Words per Bank

  16M

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  3200

• Maximum Access Time (ns)

  3.6

• Address Bus Width (bit)

  36

• Interface Type

  LVSTL

• Minimum Operating Supply Voltage (V)

  1.06|1.7

• Maximum Operating Supply Voltage (V)

  1.17|1.95

• Operating Current (mA)

  660

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Supplier Temperature Grade

  Automotive

• Number of I/O Lines (bit)

  32

• Mounting

  Surface Mount

• Package Height

  0.8(Max)

• Package Width

  10

• Package Length

  14.5

• PCB changed

  200

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  200