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DRAM 芯片

IS43LQ32128AL-062TBLI

Mobile LPDDR4/LPDDR4X

Integrated Silicon Solution Inc
数据表 

产品技术规范
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • HTS
    EA
  • Automotive
    No
  • PPAP
    No
  • DRAM Type
    DRAM
  • Chip Density (bit)
    4G
  • Number of Bits/Word (bit)
    16
  • Maximum Clock Rate (MHz)
    3200
  • Supplier Temperature Grade
    Industrial
  • Mounting
    Surface Mount
  • Package Height
    0.8(Max)
  • Package Width
    10
  • Package Length
    14.5
  • PCB changed
    200
  • Standard Package Name
    BGA
  • Supplier Package
    TFBGA
  • Pin Count
    200
订单数量

文档和资源

数据表
设计资源