DRAM 芯片

IS42S32160F-6TLI

DRAM Chip SDRAM 512Mbit 16Mx32 3.3V 86-Pin TSOP-II

Integrated Silicon Solution Inc

产品技术规范

• 欧盟RoHS指令

  Compliant

• 美国出口管制分类ECCN编码

  EAR99

• 环保无铅

  LTB

• 美国海关商品代码

  8542.32.00.28

• Automotive

  No

• PPAP

  No

• DRAM Type

  SDRAM

• Chip Density (bit)

  512M

• Organization

  16Mx32

• Number of Internal Banks

  4

• Number of Words per Bank

  4M

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  167

• Maximum Access Time (ns)

  5.4|6

• Address Bus Width (bit)

  15

• Interface Type

  LVTTL

• Minimum Operating Supply Voltage (V)

  3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  245

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  32

• Mounting

  Surface Mount

• Package Height

  1.05(Max)

• Package Width

  10.29(Max)

• Package Length

  22.42(Max)

• PCB changed

  86

• Standard Package Name

  SO

• Supplier Package

  TSOP-II

• Pin Count

  86