其他逻辑和定时产品

HV583GA-G

Serial to Parallel Converter -25°C to 125°C 169-Pin TFBGA Tray

Microchip Technology

产品技术规范

• RoHS (Unione Europea)

  Compliant

• ECCN (Stati Uniti)

  EAR99

• Stato del componente

  Active

• Codice HTS

  8542.39.00.90

• Automotive

  No

• PPAP

  No

• Type

  Serial to Parallel Converter

• Minimum Operating Temperature (°C)

  -25

• Maximum Operating Temperature (°C)

  125

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.1(Max) - 0.32

• Package Width

  10

• Package Length

  10

• PCB changed

  169

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  169

• Lead Shape

  Ball