SRAM 芯片

CY62187G30-55BAXI

SRAM Chip Async Single 3V/3.3V 64M-bit 4M x 16 55ns 48-Pin FBGA Tray

Infineon Technologies AG

产品技术规范

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.2.a.

• Part Status

  Active

• HTS

  8542.32.00.41

• Automotive

  No

• PPAP

  No

• Chip Density (bit)

  64M

• Number of Words

  4M

• Number of Bits/Word (bit)

  16

• Data Rate Architecture

  SDR

• Address Bus Width (bit)

  22

• Number of Ports

  1

• Timing Type

  Asynchronous

• Max. Access Time (ns)

  55

• Minimum Operating Supply Voltage (V)

  2.2

• Typical Operating Supply Voltage (V)

  3, 3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  55

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.14(Max)

• Package Width

  8

• Package Length

  9.5

• PCB changed

  48

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  48

• Lead Shape

  Ball

• Family/Series

  CY62187G30

• ALIAS

  SP005641997

• ROHS Version

  2011/65/EU, 2015/863

• Quantity Packaging

  210

• MSL

  3