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TLP5212XG|ISOCOM|simage
TLP5212XG|ISOCOM|limage
晶体管和光伏输出光电耦合器

TLP521-2XG

DC-IN 2-CH Transistor DC-OUT 8-Pin PDIP

Isocom Components
数据表 

产品技术规范
  • 欧盟RoHS指令
    Compliant
  • 美国出口管制分类ECCN编码
    EAR99
  • 环保无铅
    Active
  • 美国海关商品代码
    EA
  • Automotive
    No
  • PPAP
    No
  • Output Type
    DC
  • Input Type
    DC
  • Output Device
    Transistor
  • Number of Channels per Chip
    2
  • Minimum Isolation Voltage (Vrms)
    5300
  • Minimum Operating Temperature (°C)
    -30
  • Maximum Operating Temperature (°C)
    100
  • Maximum Forward Voltage (V)
    1.3
  • Maximum Collector-Emitter Voltage (V)
    55
  • Maximum Current Transfer Ratio (%)
    600
  • Standard
    BSI|UL|VDE
  • Maximum Collector-Emitter Saturation Voltage (mV)
    400
  • Maximum Power Dissipation (mW)
    200
  • Minimum Forward Voltage (V)
    1
  • Typical Forward Voltage (V)
    1.15
  • Maximum Reverse Voltage (V)
    6
  • Maximum Forward Current (mA)
    50
  • Minimum Current Transfer Ratio (%)
    50
  • Current Transfer Ratio Test Current (mA)
    5
  • Typical Rise Time (us)
    4
  • Typical Fall Time (us)
    3
  • Mounting
    Through Hole
  • Package Height
    4(Max)
  • Package Width
    7(Max)
  • Package Length
    10.16(Max)
  • PCB changed
    8
  • Standard Package Name
    DIP
  • Supplier Package
    PDIP
  • Pin Count
    8
  • Lead Shape
    Through Hole

文档和资源

数据表
设计资源