产品技术规范
RoHS (Unione Europea)
Compliant
ECCN (Stati Uniti)
3A991b.1.a.
Stato del componente
LTB
Codice HTS
8542.32.00.71
Automotive
Unknown
PPAP
Unknown
Cell Type
NAND
Chip Density (bit)
2G
Architecture
Sectored
Boot Block
No
Block Organization
Symmetrical
Address Width (bit)
29
Sector Size
128Kbyte x 2048
Page Size
2Kbyte
Number of Bits/Word (bit)
8
Number of Words
256M
Programmability
Yes
Timing Type
Asynchronous
Maximum Erase Time (s)
0.005/Block
Maximum Programming Time (ms)
0.7
Process Technology
24nm
Interface Type
Parallel
Minimum Operating Supply Voltage (V)
2.7
Typical Operating Supply Voltage (V)
3.3
Maximum Operating Supply Voltage (V)
3.6
Programming Voltage (V)
2.7 to 3.6
Operating Current (mA)
30
Program Current (mA)
30
Minimum Operating Temperature (°C)
0
Maximum Operating Temperature (°C)
70
Command Compatible
No
ECC Support
Yes
Support of Page Mode
Yes
Mounting
Surface Mount
Package Height
1
Package Width
18.4
Package Length
12.4(Max)
PCB changed
48
Standard Package Name
SO
Supplier Package
TSOP-I
Pin Count
48