Dev Kit

TC358743XBG(EL,H4)

Mobile Peripheral Devices that converts

Toshiba

产品技术规范

• 欧盟RoHS指令

  Compliant

• 美国出口管制分类ECCN编码

  EAR99

• 环保无铅

  Active

• 美国海关商品代码

  COMPONENTS

• Automotive

  No

• PPAP

  No

• Mounting

  Surface Mount

• Package Height

  0.82(Max) mm

• Package Width

  6 mm

• Package Length

  6 mm

• PCB changed

  64

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  64

• Lead Shape

  Ball