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L1GN69B114JH05|KEMET|simage
L1GN69B114JH05|KEMET|limage
多层陶瓷电容器

L1GN69B114JH05

Cap Ceramic 0.11uF 630V C0G 5% 5 Stacked 2.54mm 200°C Waffle

KEMET Corporation
数据表 

产品技术规范
  • 欧盟RoHS指令
    Not Compliant
  • 美国出口管制分类ECCN编码
    EAR99
  • 环保无铅
    Active
  • 美国海关商品代码
    8532.29.00.40
  • SVHC
    Yes
  • SVHC超标
    Yes
  • Automotive
    No
  • PPAP
    No
  • Capacitance Value
    0.11uF
  • Tolerance
    5%
  • Voltage
    630VDC
  • Equivalent Series Resistance Type
    Low
  • Dielectric
    C0G
  • Technology
    Standard
  • Microwave Application
    Yes
  • Construction
    Stacked
  • Mounting
    Through Hole
  • Termination Style
    PC Pin
  • Number of Terminals
    10
  • Terminal Pitch (mm)
    2.54
  • Case Style
    Ceramic Chip
  • Dissipation Factor (%)
    0.1
  • Size (mm)
    13.5 X 7.62 X 5.33
  • Package/Case
    5 Stacked
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    200
  • Packaging
    Waffle
  • Lead Diameter (mm)
    0.5
  • Product Length (mm)
    13.5(Max)
  • Product Depth (mm)
    7.62(Max)
  • Product Height (mm)
    5.33(Max)
  • Product Weight (g)
    3.178
  • Seated Plane Height (mm)
    7.37(Max)

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数据表
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