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ICK BGA 35X35X10

Heat Sink Passive BGA Pin Array Adhesive 15.7°C/W Black Anodized

Fischer Elektronik GmbH & Co. KG

製品技術仕様

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• Automotive

  No

• PPAP

  No

• Type

  Passive

• Thermal Resistance

  15.7(Max)

• Fin Style

  Pin Array

• Device Cooled

  BGA

• Attachment Method

  Adhesive

• Finish

  Black Anodized

• Mounting

  Adhesive

• Product Length (mm)

  35

• Product Depth (mm)

  35

• Product Height (mm)

  10