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Combo Wireless Modules

LBEE5PL2DL-921

WLAN+BT Module 2412MHz to 2472MHz/5180MHz to 5825MHz 107-Pin

Murata Manufacturing
Datasheets 

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Type 2DL is a small and very high performance module based on NXP IW611 combo chipset which supports Wi-Fi® 802.11a/b/g/n/ac/ax + Bluetooth® 5.3 BR/EDR/LE up to 601Mbps PHY data rate on Wi-fi® and 2Mbps PHY data rate on Bluetooth®. The WLAN section supports SDIO v3.0 DDR50 interface and the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data.

The IW611 implements highly sophisticated enhanced collaborative coexistence hardware mechanisms and algorithms, which ensure that WLAN, and Bluetooth® collaboration is optimized for maximum performance.

In IEEE 802.11ax mode, the WLAN operation supports rates of MCS0-MCS11 (up to 1024QAM) in 20MHz,40MHz and 80MHz channels for data rate up to 601Mbps.

Type 2DL module is packaged in an impressively small shielded form factor that facilitates integration into size- and power-sensitive applications such as IoT applications, handheld wireless system, gateway and more.



Shielded Ultra Small Wi-Fi® 11a/b/g/n/ac/ax + Bluetooth® 5.3

  • •  2.4GHz & 5GHz Wi-Fi® + Bluetooth®
  • •  Chipset: NXP IW611
  • •  Processor: No
  • •  FCC/IC "Reference" Certified


High Performance Capabilities for Internet of Things

  • •  For Smart Home, Sensor Network, Audio/Video/Voice, Gateway
  • •  802.11 a/b/g/n/ac/ax 1x1 601Mbps
  • •  NXP i.MX Linux and Android


Block Diagram


Product Technical Specifications
  • EU RoHS
    Compliant with Exemption
  • ECCN (US)
    5A992c.
  • Part Status
    Active
  • HTS
    8517.62.00.90
  • Automotive
    No
  • PPAP
    No
  • Construction
    WLAN+BT
  • Style
    Module
  • WLAN Maximum Data Rate (Mbps)
    54
  • WLAN Frequency Range (MHz)
    2412 to 2472|5180 to 5825
  • BT Frequency Range (MHz)
    2402 to 2480
  • BT Interface
    HCI|UART
  • WLAN Maximum Output Power
    16dBm
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • BT Protocol Supported
    Bluetooth v5.3 BR/EDR/LE
  • WLAN Technology
    IEEE 802.11a/b/g/n/ac/ax
  • Mounting
    Surface Mount
  • Package Height
    1.3(Max)
  • Package Width
    7.7
  • Package Length
    8.8
  • PCB changed
    107
  • Pin Count
    107

Documentation and Resources

Datasheets
Design resources