Heat Sinks

ICK BGA 35X35X10

Heat Sink Passive BGA Pin Array Adhesive 15.7°C/W Black Anodized

Fischer Elektronik GmbH & Co. KG

Product Technical Specifications

• 欧盟RoHS指令

  Compliant

• 美国出口管制分类ECCN编码

  EAR99

• 环保无铅

  Active

• Automotive

  No

• PPAP

  No

• Type

  Passive

• Thermal Resistance

  15.7(Max)

• Fin Style

  Pin Array

• Device Cooled

  BGA

• Attachment Method

  Adhesive

• Finish

  Black Anodized

• Mounting

  Adhesive

• Product Length (mm)

  35

• Product Depth (mm)

  35

• Product Height (mm)

  10