Compliant with Exemption
Configuration describes the construction, arrangement or configuration of the device.
Direction Type describes the organization for the element internal the device "Uni-Directional, or Bi-Directional".
Number of Elements per Chip
Number of Elements per Chip describes the number of elements in each chip.
Minimum Breakdown Voltage (V)
Minimum Breakdown Voltage describes the feature can be defined as the minimum voltage value when the TVS device enters avalanche high conductance region.
Maximum Clamping Voltage (V)
Maximum Clamping Voltage describes the peak voltage across the device, or the maximum voltage that the suppressor will prevent. Normally, clamping voltage is measured at IPPM.
Maximum Reverse Stand-Off Voltage (V)
Maximum Reverse Stand-Off Voltage describes the point at which devices leakage is measured to a spec. (Ir) that typically has a max. limit. Vr is also referred to as Vrwm or the maximum working voltage. Many (but not all) TVS series this number is also referred to in the specific part number, i.e.: SMB.
Maximum Peak Pulse Current (A)
Maximum Peak Pulse Current describes the peak current that the suppressor is guaranteed to survive without damage, also the current at which Vc is measured.
Maximum Reverse Leakage Current (uA)
Maximum Reverse Leakage Current describes the current, which flows when reverse bias is applied to a semiconductor junction.
Test Current (mA)
Test Current describes the Test Condition current that the device work at it.
Peak Pulse Power Dissipation (W)
Peak Pulse Power Dissipation describes the instantaneous power dissipated for a given pulse duration.
Minimum Operating Temperature (°C)
Minimum Operating Temperature describes the minimum temperature that the device can function correctly while working.
Maximum Operating Temperature (°C)
Maximum Operating Temperature describes the maximum temperature that the device can function correctly while working.
Operating Junction Temperature (°C)
-65 to 150
Operating Junction Temperature describes the temperature of the silicon die within the package of the device when the device is powered.
Tape and Reel
Packaging describes the method of containing/packaging a product for delivery or sales.
Pin Count describes number of leads attached to package body or number of contact points for each component.