Thermal Management Solutions

Defeat Heat with CUI Devices' Reliable Dc Fans, Peltier Devices & Heat Sinks

CUI Devices' thermal management line addresses the increasing thermal challenges in today’s board level electronic applications. With a superior airflow up to 200 CFM, CUI Devices' 40 ~ 120 mm dc fans feature dual ball bearing construction. Their diverse line of thermoelectric cooling (TEC) devices offer models with arcTEC™ structure, which delivers longer thermal cycle life and improved performance. Offering stamped and extruded versions, heat sinks from CUI Devices have the variety of form factors and transistor package types to meet your cooling needs.

related articles & videos

Sorry, your filter selection returned no results.

We've updated our privacy policy. Please take a moment to review these changes. By clicking I Agree to Arrow Electronics Terms Of Use  and have read and understand the Privacy Policy and Cookie Policy.

Our website places cookies on your device to improve your experience and to improve our site. Read more about the cookies we use and how to disable them here. Cookies and tracking technologies may be used for marketing purposes.
By clicking “Accept”, you are consenting to placement of cookies on your device and to our use of tracking technologies. Click “Read More” below for more information and instructions on how to disable cookies and tracking technologies. While acceptance of cookies and tracking technologies is voluntary, disabling them may result in the website not working properly, and certain advertisements may be less relevant to you.
We respect your privacy. Read our privacy policy here