IPBT103H1TDGP|SAMTEC|limage
IPBT103H1TDGP|SAMTEC|simage
Stiftleisten

IPBT-103-H1-T-D-GP

Conn Wire to Board HDR 6Power POS 4.19mm Solder ST Top Entry Thru-Hole Power Mate® Layer

Samtec
Datenblätter 

Produktspezifikationen
  • RoHS (Unione Europea)
    Compliant
  • ECCN (Stati Uniti)
    EAR99
  • Stato del componente
    Active
  • Codice HTS
    8536.69.40.40
  • Automotive
    No
  • PPAP
    No
  • Type
    Wire to Board
  • Gender
    HDR
  • Number of Contacts
    6Power
  • Number of Rows
    2
  • Termination Method
    Solder
  • Terminal Pitch (mm)
    4.19
  • Body Orientation
    Straight
  • Polarization Type
    Center Key
  • Row Spacing (mm)
    4.19
  • Maximum Current Rating (A)
    9.3/Contact
  • Maximum Voltage Rating
    400VAC|566VDC
  • Insulation Resistance (MOhm)
    5000
  • Maximum Contact Resistance (mOhm)
    15
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    105
  • Mating Cycle (Cycles)
    100
  • Packaging
    Layer
  • Product Length (mm)
    24.84
  • Product Depth (mm)
    12.04
  • Product Height (mm)
    10.29
  • Tradename
    Power Mate®
  • Tail Length (mm)
    3.3
  • Mounting
    Through Hole

Dokumentation und Ressourcen

Datenblätter
Design-Ressourcen