Choice of Laminate
For many applications, standard laminates can be used but if the PCB laminate is relatively thick, has many layers, or there are large heat capacity components, a high Tg laminate may be required.
Choice of Printed Circuit Board coating
Tin/lead hot air solder level (HASL) cannot be used on PCBs for RoHS compliant equipment. However, there are several suitable alternatives on the market. The most popular are electroless nickel / immersion gold (ENIG), immersion silver, immersion tin and organic solderability preservatives (OSPs).
PCB coating |
Advantages |
Disadvantages |
Organic solderability preservatives (OSP) |
Lowest cost lead-free option. Very thin and electrical contact can be made. |
Fragile and easily damaged by handling. Protection during storage for shortest of all alternatives, at best 6 months but less if stored in hot humid conditions. Incompatible with some fluxes. |
Immersion silver |
Thin flat coating with good solder wetting. More robust that OSP and less than half cost of ENIG. |
Solder wetting deteriorates if stored in atmosphere with sulphides. Protection during storage for ~ 6 months but can be less. |
Immersion tin |
Thin flat coating with good solder wetting. More robust that OSP and lower cost than ENIG. |
Solder wetting deteriorates during storage, particularly at high humidity. Protection during storage for ~ 6 months but can be less. |
Electroless nickel / immersion gold (ENIG) |
Best protection of all immersion coatings, up to ~ 1 year in storage. Gold has very good solder wetting. |
Most expensive option. Sometimes used to make electrical contacts but these can deteriorate. |
Lead-free HASL (SnCu solder) |
Good corrosion resistance, flat surface, good solder wetting. |
Needs new equipment. High temperature can damage PCB, very good process control needed, boards usually need to be pre-baked. |
SnPb HASL (for comparison) |
Well understood, good protection, excellent solder wetting and corrosion resistance. |
Thermal damage to PCB, surfaces tend to be uneven so not suitable for some large low profile components. |
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